一、产品简介
I Product Introduction
有机棕化是为了提供更高的多层线路板之内层结合力而设计。它具有良好粗化表面的有机金属转化层，与环氧树脂具有良好的附著力；同时也适用于各种需要提高铜面结合力的不同制程。有机棕化制程是在低温下操作，适用于垂直或水平的操作模式，且能以添加补充，溢流方式完成自动药液控制。 具有槽液寿命长、节省人工、药水等特点，及废水处理容易；高铜含量，减少换槽频率；有效解决粉红圈问题，产品品质高。
Organic oxidation is designed to provide the cohesion in multi-layer circuit. It has organic metal transfer layer with good roughened surface, and has good attachment to epoxy resin; and meanwhile, it is applicable to various processes requiring improving copper surface cohesion. The organic oxidation process is operated under low temperature, and is applicable to vertical or horizontal operating mode, and can finish automatic solution control through adding and over flow. It has such strong points as long use life of solution, saving labor and solution, easy treatment of waste water, high copper content, and reducing frequency of replacing bath, and can effectively solve the problem of pink ring and improve quality of product.

二、产品优势
II Product Advantages
1、配槽及药液维护简单；
1. Easy makeup and maintenance of solution;
2、操作安全性高、低温操作即可（＜40℃）；
2. Operation has high safety and low temperature for operation is enough (＜40℃);
3、优良的信赖性测试；
3. Good testing of reliability;
4、无粉红圈；
4. No pink ring;
5、处理能力大、操作成本低；
5. Large processing ability, and low operating cost;
6、可适用水平或垂直制程。
6. Be applicable to horizontal or vertical process;

三、配槽方法 III Makeup Method
（A） 除油槽
(A) Deoiling bath

四、分析方法
IV Analysis Method
（一）除油剂
1、 取10 ml工作液，置入250ml锥形瓶中；
1. Take 10ml working solution and place it in a 250ml conical flask;
2、加入50 ml纯水及5滴甲基橙指示剂；
2. Add 50ml pure water and 5 drops of methyl orange indicator;
3、 用0.1 N NaOH滴定，滴至黄色为终点。
3. Use 0.1 N NaOH for titration till the solution becomes yellow;
计算：浓度(%) = V0.1 N NaOH ( ml ) ×0.3
Calculation: concentration (%) = V0.1 N NaOH ( ml ) ×0.3
添加：欲提高除油槽1%时,需加槽体积的1%之除油剂。
Add: to improve 1% deoiling bath, add deoiling agent with amount be 1% of flot volume;

（二）预浸剂
(II) Pre-dipping Agent
一般在棕化槽达到换槽的同时，预浸槽应同时换槽。
When the oxidation bath shall be replaced, replace the pre-dipping bath at the same time;

(三)有机棕化剂 ZH-555A浓度
(II) Organic Oxidation Agent ZH-555A Concentration
1、量取1ML槽液于锥形瓶中，加入100mlDI水；
1. Measure 1ml solution in conical flask and add 100ml DI water;
2、加入3-5滴甲基橙指示剂,用0.1N 氢氧化钠标准溶液滴定至溶液呈黄色。
2. Add 3-5 drops of methyl orange indicator, and use 0.1N standard sodium hydroxide solution for titration till the solution becomes yellow;
计算:ZH-555A浓度g/L = 氢氧化钠标准溶液（ML）×4.9
Calculation: :ZH-555A Concentratioin g/L = tandard sodium hydroxide solution (ml) ×4.9
添加:欲提高10g/LA浓度,加槽体积2.5%的SBZH-A, 维护A浓度100g/L的最佳浓度
Add: to improve concentration A by 10g/L, add SBZH-A with amount be 2.5% of bath volume, and maintain the concentration A be 100g/L

（四）有机棕化剂 ZH-555B 浓度
(IV) Organic Oxidation Agent ZH-555B Concentration
1、量取1ML槽液于250ML锥形瓶中；
1. Measure 1ml solution in a 250ml conical flask;
2、加入100MLDI水；
2. Add 100ml DI water;
3、加入20ML 20%硫酸；
3. Add 20ml 20% sulfuric acid;
4、用0.1N 高锰酸钾标准溶液滴定至溶液呈透明为终点。
4. Use 0.1N standard potassium permanganate solution for titration till the solution becomes transparent;
计算：ZH-555B 浓度（g/L）=高锰酸钾标准液用量（ML）×1.701
Calculation: ZH-555B concentration (g/L) = usage of standard potassium permanganate solution (ml) ×1.701
添加：欲提高1g/L B浓度, 加槽体积0.35%之SBZH-B，维护B浓度15g/L的最佳浓度
Add: to improve concentration B by 10g/L, add SBZH-B with amount be 0.35% of bath volume, and maintain the concentration B be 15g/L

(五)有机棕化剂：铜离子
(V) Organic Oxidation Agent: Copper ion
1、量取1ML槽液于锥形瓶中；
1. Measure 1ml solution in a conical flask;
2、加入50ML热DI水（80-100℃）；
2. Add 50ml hot DI water (80-100℃);
3、加入4ML的浓氨水使溶液颜色呈蓝、绿色；
3. Add 4ml concentred ammonia to change the solution color into blue-green;
4、加入3滴PAN指示剂；
4. Add 3 drops of PAN indicator;
5、以0.1N EDTA标准溶液滴定颜色由深棕色至绿色终点。
5. Use 0.1N EDTA standard solution for titration till the solution changes from dark brown to green;
计算：铜离子（g/L）= V(EDTA滴定用量)× 6.354
Calculation: copper ion (g/L) = V(usage of EDTA)× 6.354

五、信赖度测试
V Reliability Test

检测项目 Testing Item	处理流程 Processing Flow	判断标准 Judge Standard
微蚀深度 Micro-etching Concentration	水平棕化线 Horizontal oxidation line	40-100
抗粉红圈 Anti-pink ring		Non
剥离强度 Stripping strength	Lamination	>4.0 1b/in(1OZ copper foil)
漂锡测试 Solder float test	Lamination	288°10Set>6Cycle无白点 无分层 288°10Set>6Cycle, no white pint, no layer
浸锡测试 Solder dipping test	Lamination	288°10Set>6Cycle无白点 无分层 288°10Set>6Cycle, no white pint, no layer
外观检查 Appearance inpsection		均匀的棕黑色 Average brown-black

（一）微蚀深度
(I) Micro-etching depth
目的：以重量差法测试内层铜面的咬蚀深度
Target: use weight-difference method to test the fretting corrosion depth of inner copper surface
步骤：
Steps:
1、取双面覆铜板（WXL）；
1. Take double-side copper-coated board (WXL);
2、以砂纸处理表面的钝化层，并以清水清洗干净；
2. Use sand paper to process the passivation layer of surface and clean with clean water;
3、以120度，20分钟烘干，并称重 W1；
3. Dry under 120℃ for 20 minutes and weight it W1;
4、走棕化全流程；
4. Go through oxidation flow;
5、以120度，20分钟烘干，并称重 W2。
5. Dry under 120℃ for 20 minutes and weight it W2;
计算方法： 微蚀深度=（W1-W2）*106/（W*L*2*2.54*8.94）
Calculation method: micro-etching depth = W1-W2）*106/（W*L*2*2.54*8.94）
（二）抗粉红圈测试
(II) Anti-pink ring test
目的：测试棕化膜层耐酸攻击的品质，以确保能有效防止粉红圈的发生
Target:test the acid-resistance of oxidation film to ensure it can effectively avoid oink ring;
步骤：
Steps:
1、取压合后的板子钻各种不同的孔径；
1. Take compressed board and drill holes with different diameter;
2、走正常的流程到蚀刻结束，蚀刻掉表面的铜；
2. Go through normal flow till the end of etching and removing the copper on surface;
3、目视观察各孔周围是否有粉红圈发生。
3. Visually observe if there is pink ring surrounding the holes;
（三）抗剥离强度测试
(III) Anti-stropping strength test
目的：测试棕化层经压合后与胶片间的结合力
Target: test the cohesion between pressed oxidation layer and film
步骤：
Steps:
1、取1OZ铜箔固定于基板表面，走棕化流程并干燥之；
1. Take 10Z copper foil and fix it on surface of baseboard, go through oxidation flow and dry it;
2、将棕化后的铜箔贴于无铜芯片上压合，压合的排列由上到下为：
2. Press oxided copper foil on copperless chip, pressing order from up to down is:
棕化铜箔/7628+1080/芯片/1080+7628/棕化铜箔；
Oxided copper foil /7628+1080/ chip /1080+7628/ oxided copper foil;
3、将压合后的铜箔经蚀刻做出标准的测试图形；
3. Etch the pressed copper foil and make standard testing figure;
4、用拉力机测试铜箔与胶片间的拉力值。
4. Use the tensile machine to test the tensile value between copper foil and film;

六、槽液寿命
VI Use Life of Solution
当槽液铜离子达到25g/L时，可将50%液排出，重新配50%体积之新液或补充添加的方式维持槽液铜离子在15g/L左右之稳定状态。
When the copper ion in solution reaches 25g/L, drain out 50% solution, re-makeup new solution with a volume of 50% or maintain copper ion at about 15g/L in solution in the way of supplemental adding.

七、产品性质
VII Product Nature