一、 产品简介
I. Product Introduction
SBT-203作为H2SO4—H2O2体系稳定剂对蚀刻稳定效果良好，该蚀刻体系能均匀微蚀铜层表面，适用于孔金属化、图形电镀及镀金、镀镍前处理过程，另外还可用于挂具退铜。
As the stabilizing agent of H2SO4—H2O2system, SBT-203 has good stabilizing effect to etching. This etching system can evenly micro etch the copper layer surface. It can be used in the process before pore metalizing, pattern and gold plating, nickel plating as well as the copper stripping of hangers.
二、装置
II. Devices
载体/工具
Carrier/tool |
材质要求
Material requirements |
槽体材质
Material of tank body |
硬质聚乙烯、聚丙烯
Rigid polyethylene, polypropylene |
三、100升工作液配制
III.Preparation of 100 liters’ working solution
品名
Product Name |
范围
Scope |
软化水
De-mineralized water |
约78升
About 78 liters |
浓硫酸（98%）
Concentrated sulfuric acid（98%） |
8升
8 liters |
| SBT-203 |
3升
3 liters |
过氧化氢（30%）
Hydrogen peroxide (30%) |
化学镀铜
Electro-less copper plating |
8升
8 liters |
| |
图形镀
Graphic plated copper |
4升
4liters |
四、工艺条件及控制指标
IV.Technical Conditions and Control Indicators
组份/参数
Components/parameters |
最佳值/工作范围/要求
Optimal value/working scope/requirement |
工作温度
Working temperature |
20-40℃ |
处理时间 化学镀铜
Processing time Electro-less copper plating |
2-3分钟
2-3 minutes |
图形铜
Graphiccopper |
0.5-1分钟
0.5-1 minutes |
| H2O2 |
>6% |
| H2SO4 |
>8% |
| Cu2+ |
<80g/L |
五、槽液维护
V.Maintenance of Solution
1. 每处理200Ft2补加浓硫酸0.5升，双氧水2升工作液，同时加入0.5升SBT-203（M101按双氧水补加量的20%补加），补加前应先舀出适量体积的工作液。
1. Add additional 0.5 liter of concentrated sulfuric acid, 2 liters of hydrogen peroxide working solution for each 200Ft2, meanwhile, add 0.5 liter of SBT-203(M101 added as per 20% of the additional hydrogen peroxide amount). Before additional adding, scoop out the right volume of the working solution.
2. 溶铜铜达80克/升工作液后需更换部分或全部槽液。
2. When the amount of dissolved copper comes up to 80 g / l liter’s working solution, part or all of the tank solution needs to be replaced.
六、分析方法
VI.Analysis Methods
试样准备：取10.0ml粗化液于100ml的容量瓶中，加D.I水至刻度
Sampling preparation: put 10.0ml coarsening solution into a 100ml volumetric flask and then add D.I water to the scale.
硫酸
Sulphuric acid
1.吸取上述稀释液20.0ml于250ml锥形瓶中，
1. Draw the above 20.0ml diluents from a 250ml conical flask,
2. 加100ml D.I.水，搅匀，加5滴甲基橙指示剂，
2. Add 100ml D.I. water, mix well and then add 5 drops of methyl orange indicator,
3.用0.1N NaOH滴定从红色到终点桔黄色，
3. 0.1N NaOH is used to titrate to orange from red,
计算： H2SO4 %（体积比）＝13.3*(0.1N× NaOH消耗ml )
Calculation: H2SO4 %（volume ratio）＝13.3*(0.1N× NaOH consumption ml )
双氧水
Hydrogen peroxide
1. 吸取稀释液20.0ml 250ml锥形瓶中，加100ml D.I.水，搅均，
1. Draw 20.0ml diluents from a 250ml conical flask, add 100ml D.I. water, and then mix well
2. 加40ml 20％ H2SO4搅均，
2. Add 40ml 20％ H2SO4, and mix well.
3. 用0.1N的KMnO4标准液滴定至粉红色，
3. 0.1N KMnO4 standard solution is titrate to pink,
计算： H2O2 %（体积比）＝12.9×0.1×(标准KMnO4消耗ml )
Calculation：H2O2 %（volume ratio）＝12.9×0.1×(Standard KMnO4 consumption ml )
铜含量
Cu content
1. 吸取稀释液5.0ml于250ml锥形瓶中，加D.I水50ml，
1. Draw 5.0ml diluents from a 250ml conical flask, add 50ml D.I. water, and mix well
2. 加10ml 1：1的氨水，10ml的甲醇，3滴PAN指示剂，搅动，
2. Add 10ml 1:1 ammonia, 10ml methanol and 3 drops PAN indicator, and then mix them well
3. 用标准0.10M EDTA滴定，直到颜色变成淡绿色，
3. Standard 0.10M EDTA is used to titrate until it becomes pale green,
计算： [Cu2+] g/L=(M.VEDTA)×63.54
Calculation: [Cu2+] g/L=(M.VEDTA)×63.54 |
